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陶瓷激光切割机-动龙门
  • 高精度切割:设备采用进口激光器,聚焦光斑最小可达5微米,确保切割精度和边缘光滑度。定位精度可达±3微米,重复精度为±2微米,适合精密切割需求。

  • 高功率激光:切割功率高达150W,切割速度快,能够适应多种陶瓷材料的切割要求。切割厚度可达1.5毫米,特别适合用于结构陶瓷和功能陶瓷的切割。

  • X/Y/Z三轴运动控制:配备X轴和Y轴的直线电机系统,通过闭环控制保证速度和定位精度,支持快速高精度的切割操作。Z轴模块包含切割头和视觉系统,配备CCD相机用于精确对位,适合复杂图形的切割。

  • 耐用性与稳定性:大理石平台确保设备的承载稳定性和耐腐蚀性,提供了良好的物理支撑,适合长时间稳定操作。

  • 可编程操作与人机界面:控制系统具有集成视觉和运动控制功能,配合CNC精密加工设备,可根据编程要求进行自动化切割操作,简化了操作过程,提高了生产效率。


Product advantage Specification parameter Process application Sample display
Product advantage

控制精度高抗干扰性强 

同轴CCD定位、激光测高反馈

切割割缝细、石墨化现象小

光电转化率高,耗电低

应用于 PCBN 、PCD、氧化铝、氧化锆、氧化硅、

碳化硅、碳化硼、碳化铝、氮化硅、氮化硼、

氮化铝、氧化镁等陶瓷材料的切割、划线、打孔。

Specification parameter
激光功率:300W/150W/500W
切割厚度:0-6mm
切割速度:0-100mm/s
行程:300*300mm
频率:≤0.08m
Process application
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About Us
Company Profile
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Culture
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Products
Glass laser cutting machine series
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Laser glue remover
Ceramic laser cutting machine series
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Metal laser cutting machine series
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Laser accessories
Solution
Sheet metal working
Semiconductor plastic sealing alloy
Brittle materials like glass
Service Support
Service Support
News
Company News
Industry Information
Molecular Company Dynamics

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