创科达精密机电

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本设备采用激光加工，广泛应用于半导体显示行业，合金塑封电阻，IC芯片残胶的清除，标记，打码，划线，检测。

应用材料：合金、陶瓷。
应用产品：合金模具塑封电阻、电子芯片模具塑、光电透镜模具塑封、合金电阻，陶瓷电阻等。

Product advantage Specification parameter Process application Sample display

Product advantage

此机只需人工将料装入料盒；

机台自动实现上下料，去除塑封残胶；

视觉筛选良品与不良品；

操作轻松简便，效率高；

高速度；

环保无污染；

Online message

Contact person:

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Content of demand:

About Us: Company Profile; Honor; Culture; Partners; History; Subsidiary introduction; R&d innovation; Join Us

Products: Glass laser cutting machine series; Glass laser drilling machine series; Laser glue remover; Ceramic laser cutting machine series; LCD screen repair machine series; Metal laser cutting machine series; Welding machine series; Marking machine series; Laser accessories

Solution: Sheet metal working; Semiconductor plastic sealing alloy; Brittle materials like glass

Service Support: Service Support

News: Company News; Industry Information; Molecular Company Dynamics

Head office address

Email: henry@ckdseiki.com

Tel: 0755-85279156

Address: No.5 Meicheng Industrial Park, Longjing Road, New Stone Community, Dalang Street, Longhua District, Shenzhen

Chongqing Branch

Email: henry@ckdseiki.com

Tel: 0755-85279156

Address: 1st Floor, Building 3, No.29 Jinyi Road, Huixing Street, Yubei District, Chongqing

Bangladesh Branch

Email: yanni@ckdseiki.com

Address:Room No # 5,14th floor, House No # 34,Road No #02, Sector # 03,
H.M. PlazUttara,Dhaka-1230

CKD EUROPE

47-223 Kędzierzyn-Koźle
Ul. Mostowa 28B
Poland
www.ckdseiki.eu
ckd.europe@ckdseiki.eu
ckdeu@ckdseiki.com
Mr. Slawomir Burski +48 604 053 922
Mr. Sebastian Stanitzek+48 668 376 075

加工精度	≤±15um
标刻线宽度	最小线宽40um
控制方式	PC
平台速度	最大空移速度800mm/s
机械精度	重复定位精度：≤0.15mm.CCD定位精度：≤0.002mm
外观尺寸	180011501889mm
设备重量(Kg)	≈1000KG
整机功率(KW)	4KW AC380V ±10%/50Hz
相对湿度	25%～80%RH
环境温度	18℃～32℃